Fischer Elektronik thermally conductive adhesive

The thermally conductive adhesive from Fischer Elektronik is suitable for the safe and thermal bonding of electronic components, such as B. High Power LEDs or mechanical components. It is an aluminum oxide-filled, temperature-resistant, impact-resistant, solvent-free and thermally conductive two-component epoxy-based adhesive with a short pot life. The thermally conductive adhesive bonds porous and non-porous surfaces of metals, glass, ceramic materials and almost all plastics. The mixing (1:1) of hardener and binder takes place through a static mixing tube with a Luer-Lock system.

features

• Thermal conductivity 1 W/mK
• Mixing ratio: 1:1
• Temperature range: -50°C to +145°C
• Curing: approx. 16 hours at room temperature, 4 hours at 60°C
• Further processing: after approx. 4-6 hours (depending on the layer thickness)
• Pot life at room temperature approx. 30 min

scope of delivery

• 1x 4ml syringe
• 3x mixer WLK M 4

Application note: Apply as little thermally conductive adhesive as possible. The adhesive's thermal conductivity is better than air, but worse than that of the heat sink. The more of the object to be cooled rests directly on the heat sink, the better. Also make sure to keep to the mixing ratio of 1:1 as precisely as possible, otherwise the paste will not harden or will only harden very slowly.