Anbieter: MechaTronix
MechaTronix heatsink MODULED PICO 4750-B
Beschreibung
MecaTronix heat sink MODULED PICO 4750-B: High-quality heat sink for your LED projects
The MecaTronix heat sink MODULED PICO 4750-B offers professional performance for your LED projects. Tailored to Zhaga Book 3 LED modules, this modular heatsink perfectly fits many application scenarios, especially in the areas of spot and downlight design from 900 - 1800 lumens. Modular heat sink from MecaTronixInnovation paired with performance, that is the heat sink MODULED PICO 4750-B. This product, manufactured by the renowned manufacturer MecaTronix, impresses with its modular design and robust aluminum construction. It offers excellent thermal conductivity and flexibility to keep your LEDs cool.
- Dimensions: 47 x 50 mm
- Weight: 125g
- Mounting holes: M3 and 6mm
- Suitable for LED modules: Zhaga Book 3
- Thermal resistance: 5.3(°C/W)
By purchasing a MecaTronix product, you benefit from the many years of experience and expert knowledge of this innovative company. You can rely on the highest quality, long-lasting products and first-class performance.
LEDs.de: Your partner for LED technologyAs your specialist for LED lighting solutions and operator of the online shop LEDs.de, we support you with your lighting projects. Whether you are a small business, a tinkerer or an end customer, we offer you world-class products and services. With 20 years of experience and specialized high-end production lines in Germany, we are proud to offer you long-lasting products that give free rein to your creativity and contribute to the well-being of society. Click here for attractive conditions and specialized services.
FAQ about MecaTronix heatsink MODULED PICO 4750-B-
Which LED modules are compatible with this heat sink?
The MecaTronix heat sink MODULED PICO 4750-B is designed for Zhaga Book 3 LED modules. -
What is the thermal resistance of this heat sink?
The thermal resistance of the MecaTronix heatsink is 5.3(°C/W). -
How can I mount the heatsink?
Installation can be done either via the existing holes (M3 and 6 mm) or using heat-conducting adhesive film or thermal adhesive.



